The IC design is the following: the chip with the aluminum pins on the polyimide basis. Technological process includes manufacture of flexible carriers using the method of bilateral photo-lithography, their attachment to standard chips by ultrasonic bonding, making them hermetic by polymer material and conduction of technological accept/reject tests including electric & thermal treatment if necessary.

It is possible to place them on plates, in metal-ceramic and metal-glass boxes and use in hybrid microdevices.

We provide complex automation of the operations of carrier manufacture, assembly, measurements and IC mounting into the apparatus, including the methods of surface mounting with the help of soldering or bonding.

The construction is set by photo-templates while the design process uses the means of IC chip projection.

Proposed is the optimal version of the IC design and manufacture technology, including multi-nomenclature production that provides for the increase of the extent of the element base packaging - on the square more than 3 times, on the volume more than 8 times.