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" Our client is a Fortune 50 Global leader in networking for the Internet."

Interconnect Technology Engineer- 3065

Job Description:

  • Responsible for interconnect reliability assessment for semiconductor component qualification.
  • Drive reliability requirements with respect to solder joint reliability and Sn whiskering to support qualification of SnPb and Pb-free interconnect technologies.
  • Engage with the internal Business Units to support packaging and module development activities.
  • Interface directly with contract manufacturers and component suppliers to resolve tactical line-down situations associated with board-level interconnect reliability issues.

Skills Required:

  • Extensive knowledge of high performance ASIC and memory packaging and modules, Pb-free and backward compatible PCA processes and solder joint reliability, as well as the Sn whisker phenomenon, reliability test methods and failure analysis techniques is required.
  • Experience in numerical methods for solder joint reliability assessment and lifetime prediction methodologies is preferred.
  • Fundamental understanding of microelectronics packaging assembly processes, materials behavior and failure mechanisms is also a prerequisite.
  • Demonstrated excellent written and verbal communication skills and proven ability to work in a cross-functional team-based environment is mandatory.

Education:

  • Graduate degree in Materials Science or Mechanical Engineering with 5+ years working experience is required.
  • Professional membership and/or industry consortia participation in IEEE, ASME, IPC, NEMI, JEDEC, etc. is a plus.

If you meet the above criteria, please send your detailed CV in strict confidence to nunchakuinferno@gmail.com . This position is urgent- please include your Current/ Expected monthly salary or your application will not be considered.

Our client will offer an attractive salary package with comprehensive benefits to the successful candidate; this position also offers excellent career prospects with a global organization.

Data collected would be used for recruitment purposes only. Applicants who do not hear from us within 8 weeks may consider their application unsuccessful.

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