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I am originally from Perak, Malaysia. After completing O level, I left for Skudai, Johor to pursue my first degree from Jul 1999 until Mar 2003. Thereafter, I worked for a boiler manucfacturer in Meru, Klang for 3 months and tried my luck working for a TV tube manufacturer in Senawang, Seremban. Things didn't turn out well in the R&D department and coincidentally opportunity to further study with granted sponsorship was in the air. So once again, I went to Skudai to pursue my master from Dec 2003 until Mar 2006.
Upon completing my master project, I accepted offer to work as FEA engineer supporting thermal mechanical analysis of flip chip ball grid array in Kulim, Kedah on Apr 2006. I transited from R&D into process equipment for new plant manufacturing specializing in flip chip ball attach on Mar 2007. On Aug 2008, I tendered a 2-months notice to terminate my great job and move to work in Singapore on Nov 2008. My first job in Singapore focused on encapsulation and laser marking. On October 2010, I have been venturing into Mechanical & Electrical services coordination for mass rapid transit.
